Weoffer the mathematical model and its software implementation allowing us to calculate the temperature at any point of the structure of microelectronic device made by the technology of installing the flip-chip devices. Additionally we determine the capacities of heat exchange of different pin. It is possible to conduct the research about the influence of various thermo-physical and structural characteristics on the temperature distribution that is necessary for the initial stages of designing the microelectronic devices.
consideration of the three-dimensional research object;
advanced class of the research objects;
high speed of calculation and precision of the results.
modeling the temperature fields of microelectronic devices or applied problems; costly experiments by providing the required temperature regime.
joint refinement of the development to industrial level.